The Application of the Transmission-Line Modelling (TLM) Method to the Simulation of Propagation and Coupling Inside Conducting Enclosures

A. P. Duffy, J. L. Herring. T. M. Benson and C. Christopoulos

10th International Zurich Symposium on Electromagnetic Compatibility, Zurich Switzerland, March 9-11 1993, pp 445-449.

Abstract

Two approaches to the modelling of propagation and coupling inside conducting enclosures using Transmission-Line Modelling (TLM) are described. Firstly, the multigrid technique is applied to a coupling problem inside a screened room and secondly, the variable mesh hybrid technique is applied to the propagation problem of a wire placed inside a conducting enclosure. For both cases the modelling methodology, limitations, advantages and disadvantages are discussed. Results of simulations are compared with experiments and confirm the validity and accuracy of both approaches.